Digi International将在2020年嵌入式世界大会上展示最新的IoT 连接、边缘计算解决方案和客户应用

Digi 推出 ConnectCore 8M Nano SOM 开发套件及其不断扩展的Digi XBee 模块、软件和工具套件。

Nuremberg, Germany, Feb. 11, 2020 – Digi International®, (NASDAQ: DGII, www.digi.com), a leading global provider of Internet of Things (IoT) connectivity products and services, today announced that it will highlight its Digi ConnectCore® 8M Nano system-on-module (SOM) development kit and the Digi XBee® Ecosystem of wireless networking modules, software, tools and services at Embedded World 2020.

Digi will host demonstrations and participate in educational sessions illustrating its award-winning embedded technology capabilities. Embedded World takes place in the Exhibition Centre Nuremberg, February 25-27. Digi will be in Hall 3, booth 225.

“Digi has long looked at Embedded World as a launch pad for our most important embedded products and software. We’re excited to continue that tradition as we launch our ConnectCore 8M Nano kits this year,” said Mark Tekippe, Director of Product Management, Digi International.

Award-winning IoT products and services
The Digi ConnectCore 8M Nano expands Digi’s i.MX SOM portfolio, complementing the ConnectCore 6 and ConnectCore 8X families and delivering customers a scalable platform that covers a wide range of applications, performance and price points.

The Digi ConnectCore 8M Nano Development Kit simplifies embedded product development and enables manufacturers to get to market faster. The kits are the result of Digi’s valued position as an Early Access Partner for NXP’s latest i.MX 8M Nano applications processor, which was first announced in December. The ConnectCore 8M Nano features pre-certified wireless connectivity, an integrated device security framework, remote management, cloud integration and a complete Linux software platform based on Yocto Project™.

Digi will demonstrate its award-winning Digi XBee® wireless networking solutions, its complete line-up of Digi ConnectCore SOMs and Digi Remote Manager®, a comprehensive IoT device monitoring application for secure asset monitoring and control.

Following its recent acquisition of Opengear, Digi will also feature a range of critical IT infrastructure products and software, including failover-to-cellular and out-of-band management solutions. Together with the XBee and ConnectCore brands, these products enable Digi to deliver a comprehensive hardware-enabled, software-defined IoT and network technology portfolio.

Digi On-Booth Demonstrations

Secure, Managed, Multiprotocol IoT Connectivity with Digi XBee
Digi will present the latest advancements in Digi XBee 3 wireless IoT networking solutions including multi-protocol support (Zigbee/802.15.4, LTE-M/NB-IoT Cellular, Bluetooth), remote management and integrated MicroPython edge compute capabilities.

Develop, Build, Deploy and Manage with Digi XBee Tools
Digi will demonstrate its complete suite of Digi XBee tools which accelerate time-to-market and enable customers to easily develop, build, deploy and manage wireless networks at scale.  Digi XBee Tools

Real-Time Image Processing and Classification with Digi ConnectCore 8X
Digi will showcase an optimized, embedded vision system with edge-based, machine learning to implement quality control in real-time. Based on Digi ConnectCore 8X SOM and Au-Zone’s DeepView™ machine learning tools, we will demonstrate how machine learning anomaly detection can be implemented using 50-100 images captured with a cellphone.

Machine Learning-based Gesture Control in the NXP Booth: Hall 4A | Stand 4A-220
This demonstration features an interactive machine learning-based gesture control using GPU and OpenCL for edge detection. It leverages Digi’s scalable ConnectCore family based on NXP’s i.MX 8X and graphics powered by SnapUI.

Graphics Performance Demonstration of Digi ConnectCore 8X + ByteSnap SnapUI
Digi will be displaying the complex graphics performance of the Digi ConnectCore 8X powered by ByteSnap’s SnapUI. The demonstration will show live CPU loading utilizing a lightweight UI framework that simplifies OpenGL development.

Digi Presentations

Adding Machine Learning-based Image Processing to your IoT Product
On Thurs., Feb. 27 from 10:00 a.m.-10:30 a.m., Andreas Burghart, Principal IoT Technology Manager at Digi International, and Brad Scott, CEO at Au-Zone Technologies, Inc., will co-host a session as part of Session 7.1 in the Embedded Vision track titled, “Adding machine learning based image processing to your IoT product; Real-time edge processing on the Digi ConnectCore 8X.”

Embedded Computing Design Panel: “Designing for Industrial Applications”
Mark Tekippe, Digi Director of Product Management, will be a panel participant in the Embedded Computing Design booth in Hall 5/5-341 on Tues., Feb. 25 from 4:00 p.m.-4:45 p.m. for “Designing for Industrial Applications,” a discussion about what is needed to ensure that your equipment runs non-stop.

Digi will also be showcased in the following booths

  • AWS Hall 5/5-310        
  • NXP Hall 4A/4A-220
  • Atlantik Hall 3/3-141
  • Codico Hall 1/1-366
  • Bressner Hall 1/1-341
  • Digi-Key Hall 4A/4A-633
  • Mouser Hall 3A/3A-111

关于 Digi International
Digi International(纳斯达克股票代码:DGII)是全球领先的业务和关键任务物联网(IoT )连接产品和解决方案提供商。我们帮助客户开发新一代互联产品和解决方案,在要求苛刻的环境中部署、监控和管理关键通信基础设施和合规标准,并提供高水平的安全性、无懈可击的可靠性和防弹性能。公司成立于1985年,目前已帮助客户连接了超过1亿台设备,并且还在不断增长。欲了解更多信息,请访问 Digi 网站www.digi.com,或致电 877-912-3444(美国)或 952-912-3444(国际)。

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