Digi XBee 3 Global LTE Cat 4 开发套件,含Digi XBee 3 Global Cat 4 模块、天线(2 个蜂窝 U.FL 和 1 个 GNSS U.FL)和开发板 (XBIB-CU-TH)

 
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部件编号

XK3-C-G4-UT-W

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Digi XBee 3 Global LTE Cat 4 开发套件为 OEM 提供了一种简单、快速的方法,将更高带宽的蜂窝连接集成到他们的设备中

Digi XBee® 3 Global LTE Cat 4 embedded smart modems bring together the power and flexibility of the Digi XBee Ecosystem with the latest in LTE cellular technology. OEMs can quickly integrate cutting-edge LTE cellular into their devices and applications, eliminating the time-consuming and expensive FCC and carrier end-device certification process.

Starting with simple examples, we provide step-by-step guidance as you assemble the Digi XBee 3 Global LTE Cat 4 Development Kit components to create reliable, low-power cellular communication connectivity for OEM devices like sensors and monitoring systems.

Each kit includes three months of cellular data service, pre-activated and ready to go, so your team can focus on your primary goal: prototyping and developing products. This kit is designed for anyone interested in getting started in the world of embedded cellular. Hardware and software engineers, corporate technologists, educators and students can quickly learn more about cellular integration using the hands-on examples included in the kit.

With the full suite of standard Digi XBee API frames and AT commands, as well as MicroPython and Digi XBee Studio, Digi XBee customers can seamlessly transition to this embedded modem with only minor software adjustments and future-proof your designs. And with Digi Remote Manager® you can configure, deploy and manage your devices from a central platform.

With over twenty years of embedded SOM experience enabling millions of globally connected products, Digi is a trusted embedded and IoT solutions provider, simplifying the way customers design, build and deploy connected applications.

Digi Wireless Design Services (WDS) offers additional support, certification assistance and custom design services to get your products to market smarter and faster.

套件包括
  • Digi XBee 3 Global LTE Cat 4 embedded modem
  • Digi XBee 3 Development Board
  • SIM card for LTE Cat 4 cellular service out of the box
  • 3 months of free cellular service*
  • Free schematic review by Digi WDS**
  • 天线和电源线

*Service is limited to ~5 MB/month and limited SMS. For testing purposes only; not for production.
**Level 1 review

Digi XBee 3 Global LTE Cat 4, 3G / 2G, GNSS
  • 硬件
    • Cellular Chipset: Thales PLS83-W
    • Form factor (connector footprint): Digi XBee® 20-pin through-hole
    • 天线选项:2 个 U.FL:蜂窝分集,1 个 U.FL:GNSS;嵌入式 Bluetooth® 天线
    • 尺寸:30.48 毫米 x 43.18 毫米(1.2 英寸 x 1.7 英寸30.48 毫米 x 43.18 毫米(1.2 英寸 x 1.7 英寸)
    • 工作温度:-40 ºC 至 80 ºC(-40 ºF 至 176 ºF)
    • SIM 卡大小:4FF Nano
  • 接口和输入/输出
    • 数据接口UART、SPI、USB
    • 运行模式透明和串行 API、USB PPP
    • Security: Digi TrustFence® security with secure boot and protected JTAG
    • Configuration tools: Digi XBee Studio (local), Digi Remote Manager® (OTA)
    • 嵌入式可编程性:MicroPython 带 8 MB 闪存/64 kB 内存
    • 输入/输出:4 条 ADC 线路(10 位)、13 个数字输入/输出、I2C
    • 蓝牙低功耗蓝牙 (BLE)
  • 细胞特征
    • 发射功率(4G LTE/3G/2G):23 dBm / 23.5 dBm / 30-33 dBm
    • 接收灵敏度(4G LTE/3G/2G):103 dBm / 110 dBm / 108 dBm
    • Supported bands:
      • LTE: B1, B2, B3, B4, B5, B7, B8, B12, B13, B18, B19, B20, B26, B28, B38, B40, B41, B66
      • 3G: B1, B2, B3, B4, B5, B6, B8, B19
      • 2G: 850, 900, 1800 and 1850 MHz
    • Downlink / uplink speeds: 
      • LTE: 150 Mbps downlink, 50 Mbps uplink
      • 3G: 14..4 Mbps downlink, 5.76 Mbps uplink
      • 2G: 237 kbps downlink and uplink
    • 双工模式:全双工
  • 电源要求(3.3 伏直流输入电源时)
    • 电源电压: 2.8 至 5.5 V
    • 峰值发射电流:禁用蓝牙时 1050 mA;启用蓝牙时 1090 mA
    • 平均发射电流: 890 mA
    • 平均接收电流:320 mA
  • 监管和运营商批准
    • FCC (USA): MCQ-XB3C2 and QIPPLS83-W
    • ISED (Canada): 1846A-XB3C2 and 7830A-PLS83W
    • CE / RED(欧洲):完成
    • RCM(澳大利亚/新西兰):待定
    • UKCA(英国):完成
    • ANATEL(巴西):完整
    • NOM (Mexico): Pending
    • Japan: Pending
    • South Africa: Pending
    • Argentina: Pending
    • PTCRB、AT&T 和 Verizon:完成
  • 保修
    • 1 年
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