The Digi XBee 3 Global LTE-M/NB-IoT Development Kit provides OEMs with a simple, quick way to integrate cellular connectivity into their devices
Digi XBee® 3 Global LTE-M/NB-IoT embedded smart modems bring together the power and flexibility of the Digi XBee Ecosystem with the latest in LTE cellular technology. OEMs can quickly integrate cutting edge LTE cellular into their devices and applications, eliminating the time-consuming and expensive FCC and carrier end-device certification process.
The Digi XBee 3 Global LTE-M/NB-IoT development kit help developers integrate cellular connectivity into applications using Digi XBee 3 Global LTE-M/NB-IoT embedded modems. Starting with simple examples, we provide step-by-step guidance as you assemble the kit components to create reliable, low-power cellular communication connectivity for OEM devices like sensors and monitoring systems.
Each kit includes three months of cellular data service, pre-activated and ready to go, so your team can focus on your primary goal: prototyping and developing products.
This kit is designed for anyone interested in getting started in the world of embedded cellular. Hardware and software engineers, corporate technologists, or educators and students can quickly learn more about cellular integration using the hands-on examples included in the kit.
With the full suite of standard Digi XBee API frames and AT commands, MicroPython and Digi XCTU®, Digi XBee customers can seamlessly transition to this embedded modem with only minor software adjustments. OEMs can future-proof your designs by adding Digi XBee 3 Global LTE-M/NB-IoT.
Ideal for any OEM business following an agile roadmap, Digi XBee 3 Global LTE-M/NB-IoT provides the flexibility to switch between wireless protocols or migrate to LTE Cat 1. Digi Remote Manager® allows you to configure, deploy and manage devices from a central platform.
套件包括
- Digi XBee 3 Global LTE-M/NB-IoT embedded modem
- Digi XBee 3 Development Board
- SIM card for LTE-M cellular service out of the box
- 3 months of free cellular service*
- Digi WDS 免费原理图审查**
- 天线和电源线
*Service is limited to ~5 MB/month and limited SMS. For testing purposes only; not for production.
**Level 1 review
Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G
- 硬件
- Cellular Chipset: Telit ME310-WW
- 外形尺寸（连接器占地面积）：Digi XBee®20 引脚通孔
- 天线选项：1 个 U.FL 蜂窝、1 个 U.FL 蓝牙®、1 个 U.FL 全球导航卫星系统
- 尺寸：24.38 毫米 x 32.94 毫米（0.96 英寸 x 1.3 英寸24.38 毫米 x 32.94 毫米（0.96 英寸 x 1.3 英寸）
- Operating temperature: -40 ºC to 85 ºC (-40 ºF to 185 ºF)
- SIM 卡大小：4FF Nano
- 接口和输入/输出
- 数据接口UART、SPI、USB
- 运行模式 (LTE-M)：透明和串行 API、USB PPP
- 运行模式 (NB-IoT)：透明、API、UDP
- 安全性Digi TrustFence®具有安全启动和受保护的 JTAG 功能
- Configuration tools: Digi XCTU® (local), Digi Remote Manager® (OTA)
- 嵌入式可编程性：微型 Python，1024 kB 闪存/64 kB RAM
- 输入/输出：4 条 ADC 线路（10 位）、13 个数字输入/输出、USB、I2C
- 蓝牙低功耗蓝牙 (BLE)
- 细胞特征
- 发射功率：最高 23 dBm（LTE-M/NB-IoT ），最高 33 dBm（2G）
- Receive sensitivity (LTE-M): -105 dBm
- Receive sensitivity (NB-IoT): -113 dBm
- Supported bands: Bands 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 27, 28, 66, 71 and 85
- 下行链路/上行链路速度（LTE-M）：下行链路速度最高 588 kbps，上行链路速度最高 1 Mbps
- 下行链路/上行链路速度（NB-IoT ）：下行链路速度高达 120 kbps，上行链路速度高达 160 kbps
- 下行链路/上行链路速度（2G）：下行链路速度高达 264 kbps，上行链路速度高达 210 kbps
- 双工模式：半双工
- 电源要求（3.3 伏直流输入电源时）
- Supply voltage: 3.3 to 4.3 VDC
- 峰值传输电流：禁用蓝牙时为 550 mA；启用蓝牙时为 610 mA
- Avg transmit current (LTE-M): 1.25 A peak, 410 mA average (GM2 modules); 450 mA peak, 200 mA average (GM1 modules)
- Avg transmit current (NB-IoT): 1.3 A peak, 410 mA average (GM2 modules); 400 mA peak, 270 mA average (GM1 modules)
- 平均发射电流（2G）：峰值 2.1 A，平均 320 mA（GM2 模块）
- 空闲：峰值 200 mA，平均 100 mA
- 省电模式：20 μA
- 深度睡眠：2.65 μA
- 监管和运营商批准
- FCC (USA): MCQ-XB3M2
- ISED (Canada): 1846A-XB3M2
- CE / RED（欧洲）：完成
- UKCA（英国）：完成
- Japan: Pending
- Brazil: Pending
- Mexico (NOM): Pending
- PTCRB、AT&T 和 Verizon：完成
- 保修